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Advanced Materials for Thermal Management of Electronic Packaging by Tong, Xingcun Colin. Publication: . XXII, 618 p. Availability: Copies available: AUM Main Library (1),
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Wave Propagation and Radiation in Gyrotropic and Anisotropic Media by Eroglu, Abdullah. Publication: . XIII, 222p. Availability: Copies available: AUM Main Library (1),
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Advanced Flip Chip Packaging by Tong, Ho-Ming. Publication: . VII, 560 p. 413 illus., 242 illus. in color. Availability: Copies available: AUM Main Library (1),
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Reliability of Microtechnology by Liu, Johan. Publication: . XIII, 204p. 50 illus. Availability: Copies available: AUM Main Library (1),
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Moisture Sensitivity of Plastic Packages of IC Devices by Fan, X.J. Publication: . XIV, 558p. Availability: Copies available: AUM Main Library (1),
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Handbook of Transparent Conductors by Ginley, David S. Publication: . XIV, 534p. 107 illus. in color. Availability: Copies available: AUM Main Library (1),
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Dielectric Polymer Nanocomposites by Nelson, J. Keith. Publication: . XX, 380p. Availability: Copies available: AUM Main Library (1),
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Fundamentals of III-V Semiconductor MOSFETs by Oktyabrsky, Serge. Publication: . XVI, 480p. 200 illus., 100 illus. in color. Availability: Copies available: AUM Main Library (1),
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Cellular Nanoscale Sensory Wave Computing by Baatar, Chagaan. Publication: . VIII, 249p. Availability: Copies available: AUM Main Library (1),
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RF and Microwave Microelectronics Packaging by Kuang, Ken. Publication: . XVI, 285 p. Availability: Copies available: AUM Main Library (1),
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Introduction to THz Wave Photonics by Zhang, Xi-Cheng. Publication: Availability: Copies available: AUM Main Library (1),
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Three Dimensional Integrated Circuit Design by Xie, Yuan. Publication: Availability: Copies available: AUM Main Library (1),
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Metamaterials by Cui, Tie Jun. Publication: . XXIV, 368p. Availability: Copies available: AUM Main Library (1),
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Strain Effect in Semiconductors by Sun, Yongke. Publication: Availability: Copies available: AUM Main Library (1),
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections by Tan, Cher Ming. Publication: . VIII, 152 p. Availability: Copies available: AUM Main Library (1),
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects by Grossmann, Günter. Publication: . VIII, 313 p. 202 illus., 22 illus. in color. Availability: Copies available: AUM Main Library (1),
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Electrical Conductive Adhesives with Nanotechnologies by Li, Yi. Publication: Availability: Copies available: AUM Main Library (1),
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Neural Information Processing by Huang, Tingwen. Publication: . XXII, 710 p. 305 illus. Availability: Copies available: AUM Main Library (1),
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Computer Vision – ECCV 2012. Workshops and Demonstrations by Fusiello, Andrea. Publication: . XXII, 611 p. 323 illus. Availability: Copies available: AUM Main Library (1),
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Pattern Recognition by Goesele, Michael. Publication: . XXI, 574p. 262 illus. Availability: Copies available: AUM Main Library (1),
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